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200 des Grad-1N/Mm dünne ED Reinheit Kupfer-der Folien-99,8% keine Splintlöcher

200 des Grad-1N/Mm dünne ED Reinheit Kupfer-der Folien-99,8% keine Splintlöcher

  • 200 des Grad-1N/Mm dünne ED Reinheit Kupfer-der Folien-99,8% keine Splintlöcher
200 des Grad-1N/Mm dünne ED Reinheit Kupfer-der Folien-99,8% keine Splintlöcher
Produktdetails:
Herkunftsort: China
Markenname: JIMA
Zertifizierung: SGS, ISO,Reach, RoHS
Modellnummer: EDCUSTD
Zahlung und Versand AGB:
Min Bestellmenge: 100kg
Preis: usd 15-20 kg
Verpackung Informationen: hölzerner Karton
Lieferzeit: 5-15 Tage
Versorgungsmaterial-Fähigkeit: 1000 Tonne pro Monat
Kontakt
Ausführliche Produkt-Beschreibung
Reinheit: 99,8% Splintlöcher: Kein
Antioxidation: 200 Grad 60 Minuten, 180 Tage 23 Grad Stärke: 1/2 Unze, 3/4 Unze, 1 Unze, 2 Unze, 3 Unze,
Farbe: Rot oder Grau Verlängerung: ≥ 2%
Dehnfestigkeit: ≥ 150 MPa Schälfestigkeit: ≥ 1 N/mm
Markieren:

200-Grad-dünne kupferne Folie

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200 Grad ED Kupfer-Folie

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1N/mm ED Kupfer-Folie

STD Standard ED Copper Foil For Phenolic Resin Board /copper nickel foil

 

Copper foils, for the wide range of high frequency circuit substrates, are designed to provide optimum performance in high reliability applications.
There are various types of copper foil are offered; in a range of weights (thicknesses). Their characteristics differ, and an understanding of these differences is important to ensure the correct selection of copper foil for each application or environmental condition.

 

Quick details

 

Thickness: 0.012-0.070 mm

Width: 5-520 mm

Length: 500-5000 M

ID: 76 mm,152 mm

Alloy: T2,C11000,C1100,C101,E-Cu58

Temper: H

 

Features:

1. the treated foil in gray or red

2. High peel strength

3. Good etch ability

4. Excellent adhesion to etching resist

 

Application:

1. Phenolic resin board

2. Epoxy board

 

Compare between CA copper foil and ED copper foil

 

1. Process: rolled copper foil (Rolling process),ED copper foil (Electrodeposition process)

2. Strength toughness: rolled copper foil is a flaky crystalline structure, so the strength and toughness is better than electrolytic copper foil, so most of the rolling copper foil used in flexible printed circuit boards.

3. Width: rolling copper foil width ≤ 620mm, electrolytic copper foil width ≤ 1380mm

4. Density: rolled copper foil higher density, the surface is relatively smooth, conducive to the production of printed circuit board after the rapid transmission of the signal, so high-frequency high-speed transmission, fine lines printed circuit board also used some calendering copper Foil.

5. Surface treatment width:rolled copper foil be limited by Surface treatment widest effective width of 520mm.

 

Package:wooden carton

 

FAQ:

 

Q1: What's your guarantee?

 

A: All our products have 6 months guarantee after received goods, if any quality problem can contact us.

Q2: What's your delivery time ?


A: The common delivery time is 5-35 working days. The specific delivery time depends on the items and the quantity of your order.


Q3: What's your minimum order quantity?


A: The MOQ is 150 kg.

 

Q4: Can you supply the sample?

 

A: We can supply samples to check the quality before bulk order. But the price will be sample price not wholesale price.

 

Q5. Do you test all your goods before delivery?


A: Yes, we have 100% test before delivery.

 

Q6. what is your standard width?

 

A: 520mm and 620mm,we accept customization for the width. we can cut it into any size that you demand after pass discussing.

 

Typical properties of Standard copper foil for phenolic resin board and epoxy board.

 

Classification

 

Unit Requirement Test Method
Foil Designation / T H M 1 2 3 IPC-4562A
Nominal thickness / 12um 1/2 OZ 3/4 OZ

1

OZ

2

OZ

3

OZ

IPC-4562A
Area Weight g/㎡ 107±4 153±5 228±8 285±10 580±15 860±20

IPC-TM-650

2.2.12.2

Purity ≥99.8

IPC-TM-650

2.3.15

Foil Profile Shiny side (Ra) սm ≤0.4 ≤0.4 ≤0.4 ≤0.4 ≤0.4 ≤0.4

IPC-TM-650

2.3.17

Matte side(Rz) um ≤6 ≤8 ≤10 ≤10 ≤15 ≤20
Tensile Strength

R.T.(23℃)

 

Mpa ≥150 ≥220 ≥235 ≥280 ≥280 ≥280

IPC-TM-650

2.3.18

Elongation

R.T.(23℃)

 

≥2 ≥3 ≥3 ≥4 ≥4 ≥4

IPC-TM-650

2.3.18

Subject Ω.g/㎡ ≤0.170 ≤0.166 ≤0.162 ≤0.162 ≤0.162 ≤0.162

IPC-TM-650

2.5.14

Peel Strength(FR-4) N/mm ≥1.0 ≥1.3 ≥1.6 ≥1.6 ≥2.1 ≥2.1

IPC-TM-650

2.4.8

Pinholes&porosity Number No

IPC-TM-650

2.1.2

Anti-oxidization R.T.(23℃) day 180 /
H.T.(200℃) Minutes 60 /

1. Standard Width,1295(±1)mm,May according to the customer request tailor.

2. We test the peel strength with FR-4(Tg140) prepreg ,please reconfirm with your pp.

 

Photos

200 des Grad-1N/Mm dünne ED Reinheit Kupfer-der Folien-99,8% keine Splintlöcher 0

Kontaktdaten
JIMA Copper

Ansprechpartner: JIMA Annie

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